PLENSETTM

PLENSET
Electrically conductive type
PLENSETTM

PLENSETTM Electrically conductive type

What is the PLENSETTM Electrically conductive type?

PLENSETTM Electrically conductive type is a conductive adhesive developed with innovative technology, featuring low-temperature curability. This product combines conductivity and adhesive properties, with the ability to cure at a low temperature of 80degC.

・Low-Temperature Curability at 80degC
PLENSETTM Electrically conductive type cures quickly at a low temperature of 80degC.
It is suitable for use with heat-sensitive electronic components and materials, significantly improving flexibility in the manufacturing process.
・Excellent Connection Reliability
It effectively suppresses galvanic corrosion, a common issue with conventional conductive adhesives.
It provides high connection reliability, enhancing the long-term reliability of the product.
・Multi-functionality
In addition to its conductive properties, it also features excellent thermal conductivity and EMI shielding.
It effectively addresses both heat dissipation and electromagnetic interference shielding for electronic devices.
These features of PLENSETTM Electrically conductive type enable it to deliver high performance and reliability in various applications, such as bonding electronic components, automotive parts, and assembling precision devices.

Have you experienced these issues?

Solder cannot be applied due to the inclusion of heat-sensitive components
case
01
icon
Mounting and joining components on a flexible substrate
case
02
icon
Inhibit galvanic corrosion
case
03
icon

Here is the product that resolves these issues. PLENSETTM Electrically conductive type

It can be cured at a low temperature of 80degC, which is unparalleled for a one-component epoxy resin electrically conductive adhesive.
Feature
#1
icon
It can be used as a substitute for solder in applications that cannot be subjected to the reflow process, such as those involving heat-sensitive components.
Feature
#2
icon
It inhibits galvanic corrosion in high-temperature and high-humidity environments, and suppresses the increase in contact resistance with nickel and tin.
Feature
#3
icon

Application example

PLENSETTM Electrically conductive type demonstrates high performance across various applications due to its excellent properties.

・Solder Replacement
PLENSETTM Electrically conductive type cures at a low temperature of 80℃, making it a viable alternative to traditional soldering methods.
This eliminates the need for high-temperature processes required in soldering, preventing the deterioration of heat-sensitive components and boards.
Additionally, the need for flux cleaning post-soldering is removed, streamlining the process.
・Die Attach Material (Heat Dissipation)
With excellent thermal conductivity PLENSETTM Electrically conductive type can be used as a die attach material.
It enhances the efficiency of heat dissipation from electronic components, ensuring stable operation and extended device life. This is particularly effective for heat management in high-power semiconductors and power devices.
・Electromagnetic Interference (EMI) Shielding
It possesses high EMI shielding properties, making it suitable for mitigating electromagnetic interference in electronic devices.
It helps prevent device malfunctions and reduces the impact of external electromagnetic waves, making it ideal for seam bonding of electronic device cases and as a shielding material within enclosures.

image

Galvanic corrosion inhibition/electrically conductive adhesives

Issues with general conductive paste

Generally, conventional conductive adhesives are composed of a dispersion of silver (Ag) powder.
However, this composition can lead to the issue of galvanic corrosion in high temperature and high humidity environments. Specifically, when using nickel (Ni) or tin (Sn) as terminal materials, a galvanic cell can form due to the potential difference in such environments, leading to galvanic corrosion. This corrosion causes an increase in contact resistance, resulting in malfunctions.
This increase in contact resistance due to corrosion negatively affects the reliability and performance of electronic devices. In the case of conductive adhesives (Ag) and terminal metals (such as Sn and Ni), the situation is as follows.

Chart
Chart
Chart
Chart

As a result, a battery is formed as shown in the figure, and the contact resistance between the electrically conductive adhesive and the metal terminal increases.

Chart
Chart
If galvanic corrosion can be inhibited...

PLENSETTM Conductive Type has the characteristic of suppressing galvanic corrosion, which commonly occurs with conventional conductive adhesives.
This innovative feature addresses many issues and expands the range of applications for conductive adhesives.
By using PLENSETTM Conductive Type, it can particularly serve as an alternative to solder. The need for reflow (high-temperature processing) and flux cleaning required with solder is eliminated. Furthermore, the low-temperature curability PLENSETTM Conductive Type allows the use of materials with low heat resistance.
This enables the use of heat-sensitive electronic components and materials, significantly increasing design flexibility.
These benefits greatly enhance manufacturing process efficiency and are expected to reduce production costs.

Chart
Chart
Chart
Chart
Mounting components on flexible substrates such as PET
Chart
Die attach material for chip components
Chart
The electrically conductive type offers an appropriate degree of both conductivity and adhesiveness.

PLENSETTM Conductive Type effectively suppresses galvanic corrosion, overcoming the challenges associated with conventional conductive adhesives, and provides an excellent solution that meets diverse manufacturing needs. This innovative product enables process efficiency, cost reduction, and greater design flexibility, making it a powerful tool for maintaining a competitive edge in the electronics industry.

Electrically conductive type product details

Refer to the table below.

Item CJ-721 CJ-727 Conditions
Characteristics Appearance Silver paste Silver paste Visual inspection
Viscosity 27Pa・s 70Pa・s E-type viscometer 25degC,5rpm
Thixotropic index 3.2 4.5 E-type viscometer 25degC,1rpm/5rpm
Standard curing conditions 80℃×60minutes Oven curing
Properties of cured materials Tensile lap shear strength 3.0N/㎟ 2.8N/㎟ Gold plating
10N/㎟ 9N/㎟ Nickel plating
Specific resistance 12x10¯4;Ω・cm 5x10¯4;Ω・cm Supporter FR-4, 25degC
Thermal conductivity 1.3W/mK 1.8W/mK Hot-disk method
The data in this document are representative values, not standard values. The contents of this document are subject to change without notice.

Application process

STEP1
Telephone or form inquiry
STEP2
Inquire about customer issues, required characteristics
STEP3
Propose and send samples for evaluation
STEP4
Customer evaluation
STEP5
Interview regarding results of evaluation
STEP6
When it is difficult to use existing products
STEP7
Consultation and consideration of development themes

Contact us / Request materials