Low temperature curing type
What is the PLENSETTM Low temperature curing type?
It can be cured in a short time at a low temperature of 60degC for 30 minutes, unparalleled for a one-component epoxy resin.
It can be used for bonding plastics, optical parts such as lenses, and heat-sensitive parts.
Low curing shrinkage and expansion coefficient result in less distortion after curing, making it highly effective for bonding precision parts.
It is available in a wide variety of viscosities and can be selected for various applications.
Fast curing can be achieved by heating at medium to high temperatures, making in-line curing possible.
Have you experienced these issues?
Here is the product that resolves these issues. PLENSETTM Low temperature curing type
Assembly of camera modules for mobile devices
Adhesion around optical lens
Adhesion to engineering plastics
Assembly and adhesion of heat-sensitive and precision parts
|Characteristics||Color tone and appearance||Black viscous liquid||Black viscous liquid||Visual inspection|
|Viscosity||60Pa･s||17Pa･s||E-type viscometer 25degC,20rpm|
|Thixotropic index||1.1||2.0||E-type viscometer 25degC,2rpm/20rpm|
|Gel time||120seconds/80degC||100seconds/80degC||Hot plate|
|Standard curing conditions||60degC×30minutes||60degC×30minutes||Hot air circulation oven|
|Properties of cured materials||Tensile lap shear strength||16N/㎟||17N/㎟||Mild steel plate|
|Glass transition temperature||55degC||44degC||TMA measurement|
|Thermal expansion coefficient||α1||50ppm||60ppm|