PLENSETTM
PLENSETTM
Low temperature curing type
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What is the PLENSETTM Low temperature curing type?
It can be cured in a short time at a low temperature of 60degC for 30 minutes, unparalleled for a one-component epoxy resin.
It can be used for bonding plastics, optical parts such as lenses, and heat-sensitive parts.
Low curing shrinkage and expansion coefficient result in less distortion after curing, making it highly effective for bonding precision parts.
It is available in a wide variety of viscosities and can be selected for various applications.
Fast curing can be achieved by heating at medium to high temperatures, making in-line curing possible.
Have you experienced these issues?
It contains materials that are damaged by heating, so high temperatures cannot be applied.
case
01
I want to switch from a two-component to a one-component adhesive.
case
02
Moisture curing or UV curing alone cannot satisfy the required characteristics.
case
03
Here is the product that resolves these issues. PLENSETTM Low temperature curing type
It has the unparalleled low temperature curing property of 60degC for 30 minutes.
Feature
#1
Low-temperature curing capability reduces stress during cooling, which is effective in controlling deformation and warping.
Feature
#2
Can be used to assemble and join electronic components and precision parts containing heat-sensitive and fragile materials.
Feature
#3
Application
Assembly of camera modules for mobile devices
Adhesion around optical lens
Adhesion to engineering plastics
Assembly and adhesion of heat-sensitive and precision parts
Low temperature curing type application example
Adhesion of camera module
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| Item | AE-901B | AE-901T-DA | Conditions | ||
|---|---|---|---|---|---|
| Characteristics | Color tone and appearance | Black viscous liquid | Black viscous liquid | Visual inspection | |
| Viscosity | 60Pa･s | 17Pa･s | E-type viscometer 25degC,20rpm | ||
| Thixotropic index | 1.1 | 2.0 | E-type viscometer 25degC,2rpm/20rpm | ||
| Gel time | 120seconds/80degC | 100seconds/80degC | Hot plate | ||
| Standard curing conditions | 60degC×30minutes | 60degC×30minutes | Hot air circulation oven | ||
| Properties of cured materials | Tensile lap shear strength | 16N/㎟ | 17N/㎟ | Mild steel plate | |
| 2.7N/㎟ | 3.4N/㎟ | Polycarbonate | |||
| Glass transition temperature | 55degC | 44degC | TMA measurement | ||
| Thermal expansion coefficient | α1 | 50ppm | 60ppm | ||
| α2 | 80ppm | 150ppm | |||
The data in this document are representative values, not standard values. The contents of this document are subject to change without notice.
Application process
Telephone or form inquiry
Inquire about customer issues, required characteristics
Propose and send samples for evaluation
Customer evaluation
Interview regarding results of evaluation
When it is difficult to use existing products
Consultation and consideration of development themes
