PLENSETTM

Adhesives & Encapsulants
PLENSETTM

Adhesives & EncapsulantsTM

About PLENSETTM

PLENSETTM is a one-component epoxy resin adhesive based on the latent curing agent technologies that Ajinomoto Fine-Techno has accumulated over the years.
Our proprietary curing system makes possible the unique features described below, and plays an important role in various fields such as camera modules and other precision electronic components, semiconductor packaging, and car electronics.

Issues with industrial adhesive and encapsulating materials

Curing at lower temperatures
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Relieving stress and bending
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Pouring into narrow spaces
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Encapsulating or protecting gas
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Applying it in situations that demand reliability
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Using it as a replacement for solder
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Temporarily fixing
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Dissipating heat
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Applying it to transparent parts
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Application

Smartphones
Hard disk drive
Other electronic devices
Optical communication
Smartphones
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Vibration devices
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Camera
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Display
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Various sensors
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Facial recognition
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Benefits of introduction and features

Since it has curing capability at 80degC and below, it is suitable for assembling electronic components that incorporate heat-sensitive materials.
Low-temperature curing capability enables curing in a few seconds at 120degC or 150degC.
Low-temperature curing capability alleviates stress caused by the shrinkage of the material during cooling.

Resolve your issues with Ajinomoto Fine-Techno's core technologies

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Product features and lineup

Insulation properties

Low temperature curing type
  • Unmatched low-temperature curing capability
  • Low-temperature curing prevents warping and deformation
  • Adhesion to heat-sensitive and precision parts
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Drop impact resistance type
  • Low-temperature curing at 80degC for 30 minutes
  • Low elasticity enables superior stress alleviation and drop impact resistance
  • Adhesion to dissimilar materials and vibration suppression
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No particle type
  • Powder-free no particle type
  • Impregnation bonding to narrow gaps possible
  • Adhesive thickness reduced to surface roughness level
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Narrow gap curing type
  • Encapsulation possible even with narrow gaps and minute amounts of coating without uncured separation
  • Application of no particle curing system
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High reliability type
  • Applications demanding higher reliability in terms of adhesiveness, toughness, and moisture resistance
  • Fast curing at high temperature
  • Applications for optical communication, 5G communication, in-vehicle equipment, and more
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Gas barrier type
  • Encapsulation possible even with narrow gaps and minute amounts of coating without uncuring separation
  • Protective encapsulation against water vapor and other gases
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Conductivity

Electrically conductive type
  • Low-temperature curing at 80degC for 60 minutes
  • Connection with heat-sensitive components
  • Galvanic corrosion inhibition, solder alternative
  • Application to wearables and flexible printed circuit boards (FPCs)
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Developing products

Hybrid UV heat curing type
  • Temporary fixing possible with UV
  • Low temperature curing (80degC) by heat is possible for areas not irradiated by UV
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Under development
Thermally conductive type
  • Compatibility of low-temperature curing and thermal conductivity. Curing possible in 30 minutes at 80degC
  • Has flexibility curable 30minutes at 80degC => Superior drop impact resistance
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under development
Transparent type
  • Highly transparent cured material
  • Low-temperature curing at 80degC for 30 minutes
  • High resistance to UV yellowing
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under development

Examples and Applications

The ability to cure at 80degC, which is lower than the heat resistance temperature of neodymium magnets, enables adhesion with minimal loss of magnetic force.
Its flexibility and high adhesiveness afford it the superior drop impact resistance required for mobile devices.
The electrically conductive type is applied to electrical connections for parts that cannot be reflowed due to the heat resistance of the parts.

Application process

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Telephone or form inquiry
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Inquire about customer issues, required characteristics
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Propose and send samples for evaluation
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Customer evaluation
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Interview regarding results of evaluation
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When it is difficult to use existing products
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Consultation and consideration of development themes

Contact us / Request materials