UV and Thermal Combination Type PLENSETTM
What is PLENSETTM UV and Thermal Combination Type?
PLENSETTM UV and Thermal Combination Type is an innovative epoxy resin adhesive
that, in addition to the excellent low-temperature curing properties of the conventional
PLENSETTM, newly incorporates a UV (ultraviolet) temporary fixing function. This unique
combination makes it ideal for assembling devices and modules where positional accuracy before and after
curing is extremely important or where active alignment is required.
Furthermore, PLENSETTM UV
and Thermal Combination Type possesses the same high flexibility as PLENSETTM Flexible Type. This
flexibility enhances impact resistance and stress relaxation, increasing the strength of the joints. By
providing flexible bonding, it enhances the reliability and durability of precision instruments and
electronic components.
Have you experienced these issues?
Here is the product that resolves these issues. PLENSETTM Narrow gap curing type
Application
- Bonding parts that require alignment, such as active alignment
- Bonding dissimilar materials and difficult-to-bond substrates (engineering plastics like LCP and PA9T, metals like gold and nickel)
- Bonding and joining flexible substrates and components that require flexibility, such as displays
It can be used in a variety of situations.
Temporary Fixation and Alignment
Temporary fixation and alignment are possible through UV curing.
Drop Impact Resistance through Stress Relaxation
After curing, it becomes a rubber-like elastomer, providing flexibility that is effective for drop impact resistance.
Vibration Suppression and Damping
After curing, it becomes a rubber-like elastomer, providing flexibility that is effective for stress relaxation and absorbing shocks and vibrations.
Image of temporary fixation
Product details
Die shear strength
Characteristics
| Item | DC-412B | 条件 | |
|---|---|---|---|
| Characteristics | Appearance | Black viscous liquid | Visual inspection |
| Viscosity | 4Pa・s | E-type viscometer,25℃, 50rpm | |
| Thixotropic index | 1.3 | E-type viscometer,25℃, 5rpm/50rpm | |
| Standard curing conditions | 3000mJ/㎠+ 80degC×30min |
UV-LED,365nm Oven curing |
|
|
Properties of cured materials |
Tensile lap shear strength | 20N/㎟ | Mild steel plate (polished) |
| Glass translation temperature |
25degC | TMA | |
| CTE α1 | 76ppm | ||
| CTE α2 | 187ppm | ||
| Young’s modulus | 400MPa | JIS K-7161 | |
| Elongation | 108% | ||
| Cure Shrinkage | 5.1% | Calculated from Specific Gravity | |
Application process
