PLENSETTM
No particle type

What is the PLENSETTM No particle type?
PLENSETTM No particle type (Grade: AE-700) is a purely liquid one-component epoxy resin
adhesive that contains no powder components.
This adhesive features an excellent infiltration capability
because the resin and hardener are completely dissolved together. This allows it to easily penetrate into narrow
and intricate parts that were difficult for conventional adhesives, ensuring complete curing of the entire bonded area.
Merits of the PLENSETTM No particle type
・No powder components: Since it contains no powder components, there are no solid particles left on the bonded surfaces, providing an exceptionally clean finish.
・Preventing contamination in precise assemblies: By preventing contamination and performance
degradation caused by the mixing of particles in the assembly of precision machinery and electronic components, it
can significantly enhance the overall reliability of the product.
・Superior flowability after application: Its
excellent flowability allows it to spread reliably into complex shapes and small spaces. It covers areas that
conventional adhesives struggled to reach, achieving uniform bonding.
Have you experienced these issues?
Here is the product that resolves these issues. PLENSETTM No particle type
preventing uncured separations as it does not use powder hardeners.




Application
・Bonding to fine gaps and narrow areas that arise after assembling circuit
boards and integrated circuits.
・Bonding to threaded parts using engineering plastics (such as LCP, PA9T)
and metal components like gold and nickel.
・Sealing and impregnating bonding for coils in transformers
and inductors Joining flexible substrates and thin-film transistors where thin adhesive layers are required.
Characteristics
Item | AE-700 | Conditions | ||
---|---|---|---|---|
Characteristics | Color tone and appearance | Brown clear liquid | Visual inspection | |
Viscosity | 11Pa・s | E-type viscometer, 25degC、5rpm | ||
Thixotropic index | 1.1 | E-type viscometer, 25degC、2rpm/20rpm | ||
Gel time | 18minutes/120degC | Hot plate | ||
Standard curing conditions | 120degC×30minutes | Hot air circulation oven | ||
Properties of cured materials | Tensile lap shear strength | 22N/㎟ | JIS K-6850 (Steel plate) | |
Glass transition temperature | 53degC | TMA measurement | ||
Thermal expansion coefficient | α1 | 75ppm | ||
α2 | 185ppm |