No particle type - Ajinomoto Fine-Techno Co.,Inc.

What is the PLENSET_TM No particle type?

PLENSET_TM No particle type (Grade: AE-700) is a purely liquid one-component epoxy resin adhesive that contains no powder components.
This adhesive features an excellent infiltration capability because the resin and hardener are completely dissolved together. This allows it to easily penetrate into narrow and intricate parts that were difficult for conventional adhesives, ensuring complete curing of the entire bonded area.

Merits of the PLENSET_TM No particle type

・No powder components: Since it contains no powder components, there are no solid particles left on the bonded surfaces, providing an exceptionally clean finish.
・Preventing contamination in precise assemblies: By preventing contamination and performance degradation caused by the mixing of particles in the assembly of precision machinery and electronic components, it can significantly enhance the overall reliability of the product.
・Superior flowability after application: Its excellent flowability allows it to spread reliably into complex shapes and small spaces. It covers areas that conventional adhesives struggled to reach, achieving uniform bonding.

Have you experienced these issues?

Difficulty in bonding narrow gaps and complex shapes.

case

01

Desiring a bonding thickness below a few microns but encountering uncured separations.

case

02

Powder components remaining in the bonding area lower product reliability.

case

03

Here is the product that resolves these issues. PLENSET_TM No particle type

Achieves uniform bonding through superior infiltration capability.

Feature

#1

Enables ultra-thin layer bonding with liquid characteristics,
preventing uncured separations as it does not use powder hardeners.

Feature

#2

No particle contamination, enabling uniform bonding.

Feature

#3

Solid dispersion one-component type (general products)

Resin permeates, but curing agent does not (separation)

Permeated area is uncured

No particle one-component type AE-700

Uniformity of the primary and curing agents even in permeated areas

Complete curing even in narrow gaps

Application

・Bonding to fine gaps and narrow areas that arise after assembling circuit boards and integrated circuits.
・Bonding to threaded parts using engineering plastics (such as LCP, PA9T) and metal components like gold and nickel.
・Sealing and impregnating bonding for coils in transformers and inductors Joining flexible substrates and thin-film transistors where thin adhesive layers are required.

Item			AE-700	Conditions
Characteristics	Color tone and appearance		Brown clear liquid	Visual inspection
	Viscosity		11Pa･s	E-type viscometer, 25degC、5rpm
	Thixotropic index		1.1	E-type viscometer, 25degC、2rpm/20rpm
	Gel time		18minutes／120degC	Hot plate
Standard curing conditions			120degC×30minutes	Hot air circulation oven
Properties of cured materials	Tensile lap shear strength		22N／㎟	JIS K-6850 (Steel plate)
	Glass transition temperature		53degC	TMA measurement
	Thermal expansion coefficient	α1	75ppm
	Thermal expansion coefficient	α2	185ppm