PLENSETTM

PLENSETTM
No particle type
PLENSETTM

PLENSETTM
 No particle type

What is the PLENSETTM No particle type?

PLENSETTM No particle type (Grade: AE-700) is a purely liquid one-component epoxy resin adhesive that contains no powder components.
This adhesive features an excellent infiltration capability because the resin and hardener are completely dissolved together. This allows it to easily penetrate into narrow and intricate parts that were difficult for conventional adhesives, ensuring complete curing of the entire bonded area.

Merits of the PLENSETTM No particle type

・No powder components: Since it contains no powder components, there are no solid particles left on the bonded surfaces, providing an exceptionally clean finish.
・Preventing contamination in precise assemblies: By preventing contamination and performance degradation caused by the mixing of particles in the assembly of precision machinery and electronic components, it can significantly enhance the overall reliability of the product.
・Superior flowability after application: Its excellent flowability allows it to spread reliably into complex shapes and small spaces. It covers areas that conventional adhesives struggled to reach, achieving uniform bonding.

Have you experienced these issues?

Difficulty in bonding narrow gaps and complex shapes.
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Desiring a bonding thickness below a few microns but encountering uncured separations.
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Powder components remaining in the bonding area lower product reliability.
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Here is the product that resolves these issues. PLENSETTM No particle type

Achieves uniform bonding through superior infiltration capability.
Feature
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Enables ultra-thin layer bonding with liquid characteristics,
preventing uncured separations as it does not use powder hardeners.
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No particle contamination, enabling uniform bonding.
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Solid dispersion one-component type (general products)
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Resin permeates, but curing agent does not (separation)矢印Permeated area is uncured
No particle one-component type AE-700
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Uniformity of the primary and curing agents even in permeated areas矢印Complete curing even in narrow gaps

Application

・Bonding to fine gaps and narrow areas that arise after assembling circuit boards and integrated circuits.
・Bonding to threaded parts using engineering plastics (such as LCP, PA9T) and metal components like gold and nickel.
・Sealing and impregnating bonding for coils in transformers and inductors Joining flexible substrates and thin-film transistors where thin adhesive layers are required.

Item AE-700 Conditions
Characteristics Color tone and appearance Brown clear liquid Visual inspection
Viscosity 11Pa・s E-type viscometer, 25degC、5rpm
Thixotropic index 1.1 E-type viscometer, 25degC、2rpm/20rpm
Gel time 18minutes/120degC Hot plate
Standard curing conditions 120degC×30minutes Hot air circulation oven
Properties of cured materials Tensile lap shear strength 22N/㎟ JIS K-6850 (Steel plate)
Glass transition temperature 53degC TMA measurement
Thermal expansion coefficient α1 75ppm
α2 185ppm
The data in this document are representative values, not standard values. The contents of this document are subject to change without notice.

Application process

STEP1
Telephone or form inquiry
STEP2
Inquire about customer issues, required characteristics
STEP3
Propose and send samples for evaluation
STEP4
Customer evaluation
STEP5
Interview regarding results of evaluation
STEP6
When it is difficult to use existing products
STEP7
Consultation and consideration of development themes

Contact us / Request materials