What is semiconductor encapsulant for advanced semiconductor packaging?
Semiconductor encapsulants are materials that protect semiconductor chips from light, heat, moisture, dust, and shock. Typically, materials are in liquid, film, and granule form. The encapsulation materials provided by AFT are being considered for application to fan-out wafer-level packaging (FO-WLP) and fan-out panel-level packaging (FO-PLP).
|Encapsulant||WLP application||PLP application||Features|
+ High liquidity
- Flow mark
+ No flow marks
- Equipment contamination by droplets
Have you experienced any of these issues?
Here are two products that resolve these issues.
|1) Liquid encapsulant||2) Film type encapsulant|
|AFT||++ Good resin flow. Applicable to molded underfill (MUF)
+ Less flow mark
+ Low warpage, low thermal expansion coefficient
+ Support various inorganic fillers, from small to large particle diameter
+ Applicable from thin film
+ Low warpage, applicable from thin film
+ Applicable to various inorganic fillers, from small to large particle diameter
|General||+ High liquidity
- Flow mark
- Compatibility with FO-PLP
Examples and Applications
Large-area batch sealing is possible mainly with compression molding equipment.
High throughput and large-area batch sealing are possible primarily through vacuum lamination.