PLENSETTM

PLENSETTM
Developing products
PLENSETTM

PLENSETTM
 Developing products

What are PLENSETTM developing products?

1) In addition to the conventional property of low-temperature curability - the core technology - we are continuing to examine and explore ways to further augment the characteristics.
Please let us know about the characteristics you require.
2) We are always open to receiving requests from you concerning adhesives. If there is a particular functionality that is not available in our current products, we will continue to work on developing it.
For instance, we are currently taking a close look at a transparent and thermally conductive type.

Have you experienced these issues?

High-performance, high-transparency adhesives and encapsulants
case
01
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Efficient dissipation of heat
case
02
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Please let us know if there are any other characteristics that you would like us to combine with low-temperature curability.
case
03
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Here is the product that resolves these issues. PLENSETTM Developing products

Feature

Core technologyLow-temperature curability
Functionalization
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Creation of new value
TransparencyProvides cured material with high transparency
Low temperature curing type and UV curing type are available.
High resistance to UV yellowing
Feature
#1
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Thermal conductivityBoth low-temperature curing and thermal conductivity
Can be cured at 80degC for 30 minutes
High-adhesion, low-elasticity type => Superior drop impact resistance
Feature
#2
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Characteristics

Item LT Series Conditions
Feature Low-temperature curability
Characteristics Color tone and appearance Yellow white viscous liquid Visual inspection
Viscosity 47Pa・s E-type viscometer
25degC,20rpm
Thixotropic index 1.0 E-type viscometer
25degC,2rpm,20rpm
Standard curing conditions 80degC×30minutes Hot air circulation oven
Properties of cured material Light transmittance 800mm 93% Spectrophotometer
100 μm thickness conversion
350mm 90%
Refractive index 1,55 Abbe refractometer
Tensile lap shear strength 2.1N/㎟ JIS K-6850 (PC)
Item FT Series Conditions
Feature Flexibility
Curing agent Color tone and appearance Black viscous liquid Visual inspection
Viscosity 24-50Pa・s E-type viscometer
25degC,20rpm
Thixotropic index 2.6 E-type viscometer
25degC,2rpm,20rpm
Standard curing conditions 80degC×60minutes Hot air circulation oven
Properties of cured material Tharmal conductivity 1.3-2.0W/mK Hot-disk method (25degC)
Tensile lap shear strength 21N/㎟ Nickel plating
13N/㎟ LCP
The data in this document are representative values, not standard values. The contents of this document are subject to change without notice.

Application process

STEP1
Telephone or form inquiry
STEP2
Inquire about customer issues, required characteristics
STEP3
Propose and send samples for evaluation
STEP4
Customer evaluation
STEP5
Interview regarding results of evaluation
STEP6
When it is difficult to use existing products
STEP7
Consultation and consideration of development themes

Contact us / Request materials