What are PLENSETTM developing products?
1) In addition to the conventional property of low-temperature curability - the core technology - we are continuing to examine and explore ways to further augment the characteristics.
Please let us know about the characteristics you require.
2) We are always open to receiving requests from you concerning adhesives. If there is a particular functionality that is not available in our current products, we will continue to work on developing it.
For instance, we are currently taking a close look at a transparent and thermally conductive type.
Have you experienced these issues?
Here is the product that resolves these issues. PLENSETTM Developing products
Low temperature curing type and UV curing type are available.
High resistance to UV yellowing
Can be cured at 80degC for 30 minutes
High-adhesion, low-elasticity type => Superior drop impact resistance
|Characteristics||Color tone and appearance||Yellow white viscous liquid||Visual inspection|
|Thixotropic index||1.0||E-type viscometer
|Standard curing conditions||80degC×30minutes||Hot air circulation oven|
|Properties of cured material||Light transmittance||800mm||93%||Spectrophotometer
100 μm thickness conversion
|Refractive index||1,55||Abbe refractometer|
|Tensile lap shear strength||2.1N/㎟||JIS K-6850 (PC)|
|Curing agent||Color tone and appearance||Black viscous liquid||Visual inspection|
|Thixotropic index||2.6||E-type viscometer
|Standard curing conditions||80degC×60minutes||Hot air circulation oven|
|Properties of cured material||Tharmal conductivity||1.3-2.0W/mK||Hot-disk method (25degC)|
|Tensile lap shear strength||21N/㎟||Nickel plating|