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PLENSETTM

PLENSETTM
Drop impact resistance type
PLENSETTM

PLENSETTM
 Drop impact resistance type

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What is the PLENSETTM Drop impact resistance type?

Generally, epoxy resin has the property of being hard and brittle, which limits its use in applications requiring impact resistance and flexibility.
However, Ajinomoto Fine-Techno's PLENSETTM Drop impact resistance type is a product that significantly transforms these conventional properties of epoxy resins.
Developed using our proprietary advanced formulation technology, this adhesive combines low-temperature curability with flexibility as its core technology.
・With excellent flexibility, it can significantly improve stress relaxation and impact resistance.
・Achieves flexible bonding while maintaining high strength.
・Provides highly reliable bonding that flexibly responds to dynamic loads such as bending and twisting.

Have you experienced these issues?

The adhesive area is so small that the adhesive part peels off or breaks during drop impact testing, etc.
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01
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The vibration and noise from the motor are loud and need to be controlled.
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Dissimilar materials, such as engineering plastics and metals, do not adhere well to each other.
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Here is the product that resolves these issues.
PLENSETTM Drop impact resistance type

It can be cured at a low temperature of 80degC, unparalleled for a one-component epoxy resin.
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Once cured, it gains a rubber-like elasticity, providing flexibility that is effective for stress alleviation as well as shock and vibration absorption.
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Due to its low elasticity, it has high peel strength and is effective for bonding dissimilar materials with large differences in linear expansion coefficients.
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Application

・Bonding of parts subject to impact and vibration
Ideal for bonding parts that are frequently subjected to physical shocks and vibrations.
It ensures reliability under harsh conditions such as smartphones requiring drop resistance and motors that generate vibrations, contributing to the long lifespan of components.
・Bonding of dissimilar materials and difficult-to-bond substrates
Suitable for bonding engineering plastics like LCP (Liquid Crystal Polymer) and PA9T (thermoplastic polyamide), as well as various metals such as gold and nickel, thus catering to a wide range of dissimilar and difficult-to-bond materials.
・Bonding and joining of flexible substrates and components like displays that require flexibility
Perfect for bonding and joining components like flexible substrates and displays that require flexibility to accommodate bending, twisting, and other dynamic movements.
・Bonding and sealing thin-film components without warping or deforming
With high flexibility and low-stress properties, it allows for bonding and sealing thin-film components without warping or deformation. This helps maintain the appearance quality and functionality of the product while enhancing reliability.
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It can be used in a variety of situations.

Drop impact resistance through stress relaxation

It can be cured at a low temperature of 80degC, unparalleled for a one-component epoxy resin.

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Vibration suppression and damping

Once cured, it gains a rubber-like elasticity, providing flexibility that is effective for stress alleviation as well as shock and vibration absorption.

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Flexural resistance, low warpage

Due to its low elasticity, it has high peel strength and is effective for bonding dissimilar materials with large differences in linear expansion coefficients.

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Product details

iconSimilar film type here

Flexibility test method for cured materials: JIS K7161 compliant

The drop impact resistance type exhibits a rubber-like flexibility.

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S-S curves of conventional thermosetting epoxy cured materials and low elasticity epoxy resin cured materials
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More flexible than conventional epoxy cured materials

Warpage in molding wafers

Wafer: 12 inches, 0.8 mm thick Mold: 0.4 mm thick
Warpage does not occur with the drop impact resistance type even when molding on one side of the wafer.

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Characteristics

Item AE-400 AE-403H AE-421H AE-421D AE-421T Conditions
Characteristics Appearance Black viscous liquid Black viscous liquid Black viscous liquid Black viscous liquid Light yellow viscous liquid Visual inspection
Viscosity 10Pa･s 7Pa･s 16Pa･s 10Pa･s 21Pa･s E-type viscometer
25degC,20rpm
Thixotropic index 1.3 1.1 2.9 1.7 3.1 E-type viscometer 25degC,
2rpm/20rpm
Standard curing conditions 80degC×30minutes Oven curing
Properties of cured materials Tensile lap shear strength 14N/㎟ 16N/㎟ 12N/㎟ 17N/㎟ 29N/㎟ Mild steel plate (polished)
9.1N/㎟ 11.4N/㎟ 13.0N/㎟ 12.6N/㎟ 21.6N/㎟ Nickel plating
2.6N/㎟ 4.8N/㎟ 5.7N/㎟ 4.8N/㎟ 7.8N/㎟ LCP
Young's modulus 8MPa 40MPa 150MPa 120MPa 52MPa JIS K-7161
Hardness 86 70 70 70 61 Shore D
The data in this document are representative values, not standard values. The contents of this document are subject to change without notice.

Application process

STEP1
Telephone or form inquiry
STEP2
Inquire about customer issues, required characteristics
STEP3
Propose and send samples for evaluation
STEP4
Customer evaluation
STEP5
Interview regarding results of evaluation
STEP6
When it is difficult to use existing products
STEP7
Consultation and consideration of development themes

Adhesives & Encapsulants

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