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“PLENSET” Electrically conductive type

The inquiry about this product

Features

  • The adhesives of this type can cure at 100degC or less, unequaled by any other one-component epoxy resin electrically conductive paste. They can be applied to heat-sensitive components. This curing and the other bonding steps can be combined into one process.
  • They cure within one minute in a medium temperature range such as 150degC, contributing to improve prodution efficiency to reduce mutiple processes by minimizing curing time.
  • CJ series as electrically conductive “PLENSET” has achieved curing at 80degC
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Uses

Variety:CA series

  • Replacement of solder
  • Die attaching adhesive
ITEM CA-40 CA-46 Conditions
Properties before
curing
Filler silver silver -
Appearance Silver
paste
Silver
paste
Visual observation
Viscosity 80Pa・s 20Pa・s E-type viscometer,
25degC, 5rpm
Thixotropic index 6.5 3.0 E-type viscometer,
25degC, 0.5rpm/5rpm
Recommended cure schedule 30min at
100degC
30min at
100degC
Convection oven
heating
Properties after
curing
Lap shear
strength
3.5N/mm2 3.5N/mm2 Cu-clad glass-
epoxy plate
Glass transition
temperature
91degC 110degC TMA
Volume
resistivity
2×10-4
ohm.cm
5×10-3
ohm.cm

Technical data presented in this document are typical experimental values and do not signify any of the products’ specifications. The data may be revised without prior notice.



Variety:CJ series

Galvanic corrosion (Bimetallic corrosion) inhibiting electrically conductive adhesive

About galvanic corrosion

This corrosion is an electrochemical oxidazation reduction process,
which occurs when two dissimilar metals are brought into
electrical contact under high temperature and high humidity condition.

  • Electric potential is high.(Ag)→Cathode
  • Electric potential is low.(Sn、Ni)→Anode

Anodal metal is corroded.
 →Contact resistance increases between Ag and Sn or Ni.

If the galvanic corrosion can be minimized,

Conductive adhesive can replaced by soldering process.
As solder reflow (at high temperature process) and/or flux cleaning are not needed,
reducing the number of production steps can be realized and low heat-resistant materials
can be combined.

ITEM CJ-721 CJ-727 Conditions
Properties before
curing
Electrically conductive
powder content
75% 80% -
Appearance Silver
paste
Silver
paste
Visual observation
Viscosity 27Pa・s 70Pa・s E-type viscometer,
25degC, 5rpm
Thixotropic index 3.2 4.5 E-type viscometer,
25degC, 0.5rpm/5rpm
Recommended cure schedule 60min at
80degC
60min at
80degC
Convection oven
Properties after
curing
Lap shear
strength
4.5N/mm2 4.5N/mm2 Cu-clad glass-
epoxy plate
Glass transition
temperature
88degC 92degC TMA
Volume
resistivity
1.2×10-3
ohm.cm
5.0×10-4
ohm.cm

Technical data presented in this document are typical experimental values and do not signify any of the products’ specifications. The data may be revised without prior notice.

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The inquiry about this product
The Ajinomoto fine-techno are a company which bears the core of the fine-chemicals enterprise of Ajinomoto groups including insulating material "Ajinomoto Build-up Film"(ABF).
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