- Replacement of solder
- Die attaching adhesive
“PLENSET” Electrically conductive type
Features
- The adhesives of this type can cure at 100degC or less, unequaled by any other one-component epoxy resin electrically conductive paste. They can be applied to heat-sensitive components. This curing and the other bonding steps can be combined into one process.
- They cure within one minute in a medium temperature range such as 150degC, contributing to improve prodution efficiency to reduce mutiple processes by minimizing curing time.
- CJ series as electrically conductive “PLENSET” has achieved curing at 80degC
Uses
Variety:CA series
| ITEM | CA-40 | CA-46 | Conditions | |
|---|---|---|---|---|
| Properties before curing |
Filler | silver | silver | – |
| Appearance | Silver paste |
Silver paste |
Visual observation | |
| Viscosity | 80Pa･s | 20Pa･s | E-type viscometer, 25degC, 5rpm |
|
| Thixotropic index | 6.5 | 3.0 | E-type viscometer, 25degC, 0.5rpm/5rpm |
|
| Recommended cure schedule | 30min at 100degC |
30min at 100degC |
Convection oven heating |
|
| Properties after curing |
Lap shear strength |
3.5N/mm2 | 3.5N/mm2 | Cu-clad glass- epoxy plate |
| Glass transition temperature |
91degC | 110degC | TMA | |
| Volume resistivity |
2×10-4 ohm.cm |
5×10-3 ohm.cm |
||
Technical data presented in this document are typical experimental values and do not signify any of the products’ specifications. The data may be revised without prior notice.
Variety:CJ series
Galvanic corrosion (Bimetallic corrosion) inhibiting electrically conductive adhesive
About galvanic corrosion
This corrosion is an electrochemical oxidazation reduction process,
which occurs when two dissimilar metals are brought into
electrical contact under high temperature and high humidity condition.
- Electric potential is high.（Ag）→Cathode
- Electric potential is low.（Sn、Ni）→Anode
Anodal metal is corroded.
→Contact resistance increases between Ag and Sn or Ni.
If the galvanic corrosion can be minimized,
Conductive adhesive can replaced by soldering process.
As solder reflow (at high temperature process) and/or flux cleaning are not needed,
reducing the number of production steps can be realized and low heat-resistant materials
can be combined.
| ITEM | CJ-721 | CJ-727 | Conditions | |
|---|---|---|---|---|
| Properties before curing |
Electrically conductive powder content |
75％ | 80％ | – |
| Appearance | Silver paste |
Silver paste |
Visual observation | |
| Viscosity | 27Pa･s | 70Pa･s | E-type viscometer, 25degC, 5rpm |
|
| Thixotropic index | 3.2 | 4.5 | E-type viscometer, 25degC, 0.5rpm/5rpm |
|
| Recommended cure schedule | 60min at 80degC |
60min at 80degC |
Convection oven | |
| Properties after curing |
Lap shear strength |
4.5N/mm2 | 4.5N/mm2 | Cu-clad glass- epoxy plate |
| Glass transition temperature |
88degC | 92degC | TMA | |
| Volume resistivity |
1.2×10-3 ohm.cm |
5.0×10-4 ohm.cm |
||
Technical data presented in this document are typical experimental values and do not signify any of the products’ specifications. The data may be revised without prior notice.
