Low-temperature curing possible at 60°degC –PLENSET™ Low temperature curing type

What is the PLENSET_TM Low temperature curing type?

PLENSET_TM Low temperature curing type is an innovative one-component epoxy resin adhesive unparalleled in the market, capable of curing at the extremely low temperature of 60℃ in just 30 minutes. This superior low-temperature curing characteristic makes it ideal for bonding heat-sensitive plastics, optical components, and lenses, ensuring a wide range of applications across various environments.
Furthermore, the PLENSET_TM Low temperature curing type boasts a low cure shrinkage rate and a low coefficient of expansion, resulting in minimal post-cure distortion. This feature makes it exceptionally effective for bonding components and devices that require high precision.
PLENSET_TM Low temperature curing type can be tailored to various application methods. It can be adapted for point dispensing, line dispensing, and full-surface dispensing, thereby enhancing the design flexibility of products and achieving improved efficiency and accuracy in manufacturing processes.
It can achieve fast curing through medium-to-high temperature heating, simplifying the in-line curing process. This capability boosts the throughput of production lines and maximizes production efficiency. An efficient curing process maintains high product quality while supporting customers in reducing manufacturing costs and delivering products in a timely manner, thereby contributing to solving customer challenges.

Have you experienced these issues?

It contains materials that are damaged by heating, so high temperatures cannot be applied.

case

01

I want to switch from a two-component to a one-component adhesive.

case

02

Moisture curing or UV curing alone cannot satisfy the required characteristics.

case

03

Here is the product that resolves these issues. PLENSET_TM Low temperature curing type

It has the unparalleled low temperature curing property of 60degC for 30 minutes.

Feature

#1

Low-temperature curing capability reduces stress during cooling, which is effective in controlling deformation and warping.

Feature

#2

Can be used to assemble and join electronic components and precision parts containing heat-sensitive and fragile materials.

Feature

#3

Application

Assembly of camera modules for mobile devices
Adhesion around optical lens
Adhesion to engineering plastics
Assembly and adhesion of heat-sensitive and precision parts

Low temperature curing type application example

Adhesion of camera module

Adhesion of lens and lens barrel Affixing the filter to the lens barrel Affixing the lens barrel to the board

Item			AE-901B	AE-901T-DA	Conditions
Characteristics	Color tone and appearance		Black viscous liquid	Black viscous liquid	Visual inspection
	Viscosity		60Pa･s	17Pa･s	E-type viscometer 25degC,20rpm
	Thixotropic index		1.1	2.0	E-type viscometer 25degC,2rpm/20rpm
	Gel time		120seconds/80degC	100seconds/80degC	Hot plate
Standard curing conditions			60degC×30minutes	60degC×30minutes	Hot air circulation oven
Properties of cured materials	Tensile lap shear strength		16N/㎟	17N/㎟	Mild steel plate
	Tensile lap shear strength		2.7N/㎟	3.4N/㎟	Polycarbonate
	Glass transition temperature		55degC	44degC	TMA measurement
	Thermal expansion coefficient	α1	50ppm	60ppm
	Thermal expansion coefficient	α2	80ppm	150ppm