PLENSETTM

PLENSETTM
Low temperature curing type
PLENSETTM

PLENSETTM
 Low temperature curing type

What is the PLENSETTM Low temperature curing type?

PLENSETTM Low temperature curing type is an innovative one-component epoxy resin adhesive unparalleled in the market, capable of curing at the extremely low temperature of 60℃ in just 30 minutes. This superior low-temperature curing characteristic makes it ideal for bonding heat-sensitive plastics, optical components, and lenses, ensuring a wide range of applications across various environments.
Furthermore, the PLENSETTM Low temperature curing type boasts a low cure shrinkage rate and a low coefficient of expansion, resulting in minimal post-cure distortion. This feature makes it exceptionally effective for bonding components and devices that require high precision.
PLENSETTM Low temperature curing type can be tailored to various application methods. It can be adapted for point dispensing, line dispensing, and full-surface dispensing, thereby enhancing the design flexibility of products and achieving improved efficiency and accuracy in manufacturing processes.
It can achieve fast curing through medium-to-high temperature heating, simplifying the in-line curing process. This capability boosts the throughput of production lines and maximizes production efficiency. An efficient curing process maintains high product quality while supporting customers in reducing manufacturing costs and delivering products in a timely manner, thereby contributing to solving customer challenges.

Have you experienced these issues?

It contains materials that are damaged by heating, so high temperatures cannot be applied.
case
01
icon
I want to switch from a two-component to a one-component adhesive.
case
02
icon
Moisture curing or UV curing alone cannot satisfy the required characteristics.
case
03
icon

Here is the product that resolves these issues. PLENSETTM Low temperature curing type

It has the unparalleled low temperature curing property of 60degC for 30 minutes.
Feature
#1
icon
Low-temperature curing capability reduces stress during cooling, which is effective in controlling deformation and warping.
Feature
#2
icon
Can be used to assemble and join electronic components and precision parts containing heat-sensitive and fragile materials.
Feature
#3
icon

Application

Assembly of camera modules for mobile devices
Adhesion around optical lens
Adhesion to engineering plastics
Assembly and adhesion of heat-sensitive and precision parts

Low temperature curing type application example
Adhesion of camera module
Adhesion of lens and lens barrel Affixing the filter to the lens barrel Affixing the lens barrel to the board
Item AE-901B AE-901T-DA Conditions
Characteristics Color tone and appearance Black viscous liquid Black viscous liquid Visual inspection
Viscosity 60Pa・s 17Pa・s E-type viscometer 25degC,20rpm
Thixotropic index 1.1 2.0 E-type viscometer 25degC,2rpm/20rpm
Gel time 120seconds/80degC 100seconds/80degC Hot plate
Standard curing conditions 60degC×30minutes 60degC×30minutes Hot air circulation oven
Properties of cured materials Tensile lap shear strength 16N/㎟ 17N/㎟ Mild steel plate
2.7N/㎟ 3.4N/㎟ Polycarbonate
Glass transition temperature 55degC 44degC TMA measurement
Thermal expansion coefficient α1 50ppm 60ppm
α2 80ppm 150ppm
The data in this document are representative values, not standard values. The contents of this document are subject to change without notice.

Application process

STEP1
Telephone or form inquiry
STEP2
Inquire about customer issues, required characteristics
STEP3
Propose and send samples for evaluation
STEP4
Customer evaluation
STEP5
Interview regarding results of evaluation
STEP6
When it is difficult to use existing products
STEP7
Consultation and consideration of development themes

Contact us / Request materials