One Component Epoxy Adhesive “PLENSET”
“PLENSET” is a series of one-component epoxy resin adhesive based on latent curing agent technologies which have been successively developed by Ajinomoto Fine-Techno. Thanks to our unique curing system & features, our products play a very important role in various fields such as precision electronic components (e.g. camera module), semiconductor packaging, and car electronics.
Application example of “PLENSET“
- For smartphone
- For hard disk
Points for applying “PLENSET”：Excellent drop impact resistance.
Points for applying “PLENSET”：Impregnation, No outgassing due to uncured separation
Other assumed application
These adhesive types are available for Electronic components assembly such as optical communications, 5G communications, high-speed transmission devices, sensor component mounting and small special motors.
Ajinomoto Fine-Techno’s “PLENSET” can provide good solutions for customers’ requests such as high strength, high adhesion, high reliability, stress relaxation, and impact resistance by combining the core technology “low temperature curable & high temperature curable” with various function including flexibility, impregnation adhesion, gas barrier, and conductivity.
Do you have any requests for adhesives and sealants?
- To cure at
a lower temperature.
- To relieve
- To fill in
the narrow gaps.
- To seal and
protect the gas.
- Need reliability.
- To replace the solder.
- To need a temporary fixing.
- To dissipate heat.
- To need transparency.
We can provide good solution with Ajinomoto Fine-Techno’s core technology.
We create new value
by adding various functions based
on our core technology.
Core technology.1 :
“Low temperature (~80deg.C) curing system”
You can apply which to heat-sensitive parts or suppress heat-induced deformation.
Core technology.2 :
“High temperature (150deg.C) with fast curing system (a few seconds)”
You can shorten the curing process.
Products features & line-up
Ultra-low temperature curing type
Unique low-temperature curing.
Thanks to low temperature curing, suppression of warpage and deformation.
Adhesion to heat-sensitive parts and precision parts.
Low temperature curing 30min at 80degC.
Excellent stress relaxation due to low elasticity.
Adhesion to dissimilar materials & vibration suppression.
Perfect liquid type
Completely liquid type without powder.
Enables impregnation adhesion to narrow gaps.
Adhesive thickness can be made as thin as surface roughness level.
Adhesive thickness controllable to surface roughness level.
Sealing for narrow gap with small amount dispensing without uncured separation.
Perfect liquid curing system is applied.
High reliability type
Applications for which higher reliability is required, such as high adhesiveness, high toughness, and high moisture resistance.
Fast curing at high temperature.
Applications such as optical communication, 5G communication, and in-vehicle equipment etc.
Gas barrier type
Sealing for narrow gap with small dispensing amount without uncured separation.
Protection from moisture and other gases permeation.
Employed in various applications.
Line-up includes refrigeration storage type.
Electrically conductive type
Galvanic corrosion inhibiting
Curing condition: 80deg.C – 60min.
Providing high reliability by Galvanic corrosion inhibition property.
Applied for adhesion of heat sensitive components, wearable and flexible printed circuit boards (FPC), and solder substitution.
UV/thermal dual cure type
Temporary fixing of precision component by UV curing.
Non-UV irradiated areas adhesion by thermal cure (80deg.C).
Thermal conductive type
Combination of thermal dissipation with low temperature hardening. (80deg.C – 30min.)
Excellent drop impact resistance with low elasticity.
Optical clarity with low temperature curing condition. (80deg.C – 30min.)
Good yellowing resistance under UV exposure.