Functional adhesive/encapsulation film (developing product)
What is low temperature curing film?
Epoxy adhesive film that can be cured at 100degC
It can adhere to a wide range of substrates, including glass, metal, and plastic. It is ideal for bonding materials with different thermal expansion coefficients, or for applications such as heat-sensitive electronic components and devices.
We can also propose the addition of functions such as low warpage, low thermal expansion coefficients, transparency, and thermal conductivity.
Have you experienced these issues?
Here is the product that resolves these issues. TR Series low temperature curing film
|Transparency||Low warpage||Low CTE||–|
|Standard Thickness||μm||10, 20, 50|
|CTE <Tg（x-y）||ppm/K||54||110||22||Tensile TMA|
|Young’s modulus||GPa||1.5||0.1||16||JIS K-7161|
The contents in this sheet may be revised without prior notice.