AFTINNOVATM EF
(AEF)series

Functional adhesive/encapsulation film (developing product)
AFTINNOVATM EF(AEF)series

Functional adhesive/encapsulation film (developing product)

TR Series
What is low temperature curing film?

Epoxy adhesive film that can be cured at 100degC
It can adhere to a wide range of substrates, including glass, metal, and plastic. It is ideal for bonding materials with different thermal expansion coefficients, or for applications such as heat-sensitive electronic components and devices.
We can also propose the addition of functions such as low warpage, low thermal expansion coefficients, transparency, and thermal conductivity.

Have you experienced these issues?

Avoiding use of high temperatures for electronic component mounting and bonding
case
01
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Eliminating warpage when bonding dissimilar materials
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Need adhesive film with functions such as transparency and high insulation
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Here is the product that resolves these issues. TR Series low temperature curing film

Feature
#1
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A thermosetting low-temperature adhesive sheet that can be cured at 100degC.
Feature
#2
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Low-temperature curing enables bonding of dissimilar materials with low warpage.
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Feature
#3
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We can provide various functions such as transparency and thermal conductivity.
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Typical characteristics

Evaluation item Unit TR01 TR40 TR80 Condition
    Transparency Low warpage Low CTE
Standard Thickness μm 10, 20, 50
CTE <Tg(x-y) ppm/K 54 110 22 Tensile TMA
Tg deg.C 105 67 100 DMA
Young’s modulus GPa 1.5 0.1 16 JIS K-7161
Elongation % 4.8 85 2.5
These data are measurement values, not the values for guaranteeing.
The contents in this sheet may be revised without prior notice.

Application example

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Application process

STEP1
Telephone or form inquiry
STEP2
Inquire about customer issues, required characteristics
STEP3
Propose and send samples for evaluation
STEP4
Customer evaluation
STEP5
Interview regarding results of evaluation
STEP6
When it is difficult to use existing products
STEP7
Consultation and consideration of development themes

Contact us / Request materials