AFTINNOVATM EF（AEF）series
Functional adhesive/encapsulation film (developing product)
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TR Series
What is low temperature curing film?
Epoxy adhesive film that can be cured at 100degC
It can adhere to a wide range of substrates, including glass, metal, and plastic. It is ideal for bonding materials with different thermal expansion coefficients, or for applications such as heat-sensitive electronic components and devices.
We can also propose the addition of functions such as low warpage, low thermal expansion coefficients, transparency, and thermal conductivity.
Have you experienced these issues?
Avoiding use of high temperatures for electronic component mounting and bonding
case
01
Eliminating warpage when bonding dissimilar materials
case
02
Need adhesive film with functions such as transparency and high insulation
case
03
Here is the product that resolves these issues. TR Series low temperature curing film
Feature
#1
A thermosetting low-temperature adhesive sheet that can be cured at 100degC.
Feature
#2
Low-temperature curing enables bonding of dissimilar materials with low warpage.
Feature
#3
We can provide various functions such as transparency and thermal conductivity.
Typical characteristics
| Evaluation item | Unit | TR01 | TR40 | TR80 | Condition |
|---|---|---|---|---|---|
| Transparency | Low warpage | Low CTE | - | ||
| Standard Thickness | μm | 10, 20, 50 | |||
| CTE <Tg（x-y） | ppm/K | 54 | 110 | 22 | Tensile TMA |
| Tg | deg.C | 105 | 67 | 100 | DMA |
| Young's modulus | GPa | 1.5 | 0.1 | 16 | JIS K-7161 |
| Elongation | % | 4.8 | 85 | 2.5 | |
These data are measurement values, not the values for guaranteeing.
The contents in this sheet may be revised without prior notice.
The contents in this sheet may be revised without prior notice.
Application example
Application process
Telephone or form inquiry
Inquire about customer issues, required characteristics
Propose and send samples for evaluation
Customer evaluation
Interview regarding results of evaluation
When it is difficult to use existing products
Consultation and consideration of development themes
