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Laser ablation type Solder resist (Under development)

+81-44-221-2375The inquiry about this product

Advantage

vs Photoimageable Solder resist

Non photosensitive materials (without acryl resin)

High resistance against crack
Lower water absorption & high insulation reliability

Easy handling

Good environmental conditions with no outgas
Efficient production attained by simultaneous processing on both side of the substrate

Excellent Process efficiency

 

Solder resist

Construction

Construction
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Process

cure solder-resist opening desmear cure
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Description

Model Feature
ABF-GX13G07 Standard
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Process

Process
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Characteristics

Test condition GX13 GX13-G07
CTE x-y (25-150degC) (Tensile TMA) 46 50
CTE x-y (150-250degC) (Tensile TMA) 120 122
Tg (Tensile TMA) 156 159
Tg (DMA) 177 177
Young’s modulus (GPa) 4 4.4
Tensile strength (MPa) 93 89
Elongation (%) 5 5.7
Dielectric constant (5.8 GHz) 3.1 3.1
Loss Tangent (5.8 GHz) 0.019 0.018
Water absorption  100degC,1h (wt%) 1.1 1.2
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+81-44-221-2375The inquiry about this product
The Ajinomoto fine-techno are a company which bears the core of the fine-chemicals enterprise of Ajinomoto groups including insulating material ABF series.
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